Application Specific Integrated Circuits (ASICs) and Foundry

Honeywell's trusted foundry of microelectronics provide strategically, radiation-hardened, integrated circuits and technology for aerospace systems and electrical designers. This helps increase performance, reduce risks and ensure successful missions in space and in other radiation-prone environments.

The Honeywell silicon on insulator (SOI) complementary metal oxide semiconductor (CMOS) foundry is the foundation for manufacturing integrated circuits. Today, we are able to build custom application specific integrated circuits (ASICs) up to 15M gates. Additionally, we build a wide array of standard products including SRAMs, MRAMs, SERDES, processors, data converters, among others to suit your needs.

Newly available Multi-Project Wafer (MPW) foundry services allow you to produce designs in lower quantities and lower cost. Sharing wafer resources can reduce prototype costs of next-gen chips up to 80% compared to a full wafer run.

Our products and capabilities continue to expand using trusted, QML V qualified and flight proven technology. These services include digital and mixed signal design, integrated circuit assembly and screening and test.

The Proof Of Design (PODs) and Engineering Model (EM) version of the products, while not formally specified, are generally expected to meet a Total Dose Radiation level of 100KRad(Si). The PODs and EMs are not to be used for flight.
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