Our microelectronics design team will help you allocate roles, responsibilities and resources in an efficient, expedited manner so that you can focus on developing systems and software.
Our design services team is up-to-date on complementary metal oxide semiconductor (CMOS) technology and has the expertise and resources to produce optimal application specific integrated circuit (ASIC) design projects. The team of designers combined with our proven ASIC infrastructure offer extensive experience in architectures, functional verification, intellectual property insertion, power management and production of Honeywell's microelectronics.
We offer the most effective and low risk options available to co-develop, transfer or convert your designs into Honeywell's advanced, radiation-hardened, silicon on insulator complementary metal-oxide-semiconductor SOI CMOS technologies.
Our customer design engineers provide a wide range of support for your complex designs and system on chip (SOC) designs. We support the design development by starting with customer engagement driving the architectural trade-off discussions and delivery of design kits through design handoff, efficient placement and routing, timing closure, tape out, fabrication and product delivery.
Our team of hardware description language (HDL) designers and verification engineers are available to assist customers with logic, help with IP implementation and design verification and support system requirements prior to netlist handoff.
You will encounter a variety scalable front and back-end design resources, flexible design handoff points (e.g., specification, RTL, netlist) and a team ready to collaborate to bring you the best solution.
Contact Honeywell’s Design Team to take your design to the next level at 1-800-323-8295.