How Penn State Is Helping Honeywell Keep Current on Latest 3-D Printing Innovations

November 14, 2016 | Author: Donald Godfrey

Ever since Honeywell began working with metal powder-bed-fusion technology, the company has had a close working relationship with universities in North America and Europe. The first Monday of each month, Honeywell hosts a global webcast where companies or universities working in the area of cutting edge 3D printing technology are invited to present their work to a global Honeywell audience.

The long-running webinar across Honeywell helps educate our engineering and supply chain workforce that 3D printing – also known as additive manufacturing (AM) – is not just for prototypes. Designing for additive manufacturing can result in definite competitive advantages.

Simpson TimothyIn November, Honeywell welcomed Dr. Timothy Simpson from The Pennsylvania State University to the webinar series. He brought his well-established expertise to a presentation on "Design for Additive Manufacturing: Challenges & Research Opportunities."

Simpson is a Professor of Mechanical & Industrial Engineering with affiliations in Engineering Design, Information Sciences & Technology, and Architecture. He helps manage an additive manufacturing research portfolio that exceeds $8 million annually as co-director of Penn State’s Center for Innovative Materials Processing through Direct Digital Deposition (CIMP-3D). It serves as the DARPA Open Manufacturing Program’s Additive Manufacturing Demonstration Facility (MDF).

As Simpson pointed out in his presentation, additive manufacturing provides engineers with unprecedented design and material freedom. Thanks to AM technology, engineers can consolidate assemblies into a single integrated component, lightweight parts using topology optimization and lattice structures, and functionally-grade structures and components made from multiple materials.

While many advocate "complexity is free" when it comes to AM, understanding the design, material and process limitations associated with it is important when producing end-use parts.

Simpson’s presentation touched on the challenges associated with part substitution, consolidation and optimization for AM, with an emphasis on laser-based powder bed fusion systems. He illustrated the challenges associated with design workflow, part selection and support structures.

His examples were drawn from activities at CIMP-3D, where the mission is to:

  • Advance enabling technologies required to successfully implement AM technology for critical components and structures
  • Provide technical assistance to industry through selection, demonstration and validation of AM technology as an "honest broker" and
  • Promote the potential of AM technology through training, education and dissemination of information.

CIMP-3D also provides Penn State’s interface to America Makes, the National Additive Manufacturing Innovation Institute (NAMII).

As a leader at the forefront of AM technology, Simpson helped launch and served as Chair of the Executive Advisory Committee for the 2015 and 2016 American Society of Mechanical Engineers (ASME) Additive Manufacturing and 3D Printing Conference & Expo. He is a Fellow in ASME and Associate Fellow with the American Institute of Aeronautics and Astronautics. Simpson also has been PI or Co-PI on over $30M in funding for his own research in product family and product platform design, additive manufacturing and 3D printing, and design innovation and entrepreneurship. He has published over 300 peer-reviewed papers and 2 edited textbooks, and he is currently co-authoring a new textbook on "Design for Additive Manufacturing."

At Honeywell, Simpson’s webinar was heard by several hundred employees from four continents who attended in person or via connection. These monthly webinars are just another way Honeywell is exposing its engineers to innovative thought leaders in this exciting new technology area, helping ensure it’s applied in the most effective way possible to benefit our customers.

Donald Godfrey

Donald Godfrey

Donald Godfrey is an engineering fellow at Honeywell Aerospace.

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